Maybe later but honestly, full custom loops are a little hardcore even for me. Apart from the cost (approaches 1000? for a nice loop) it takes quite some effort and skill to get it right the first time, and requires maintenance... not to mention having to re-engineer parts of it later in case parts get upgraded like now. Air is so wonderfully easy and even good these days.
As CD82 said, the big investment of everything besides the GPU blocks tends to last for ages, and in the case of the GPU, you can get EVGA's hydrocopper cards if you're particularly lazy.
As for maintenance, I gave it a really good think a while ago, and I reckon that using something completely inert like 3M's Novec-7500 would make it completely maintenance free. You'd likely need more pumps though - the various Novec formulations all hover around 1.4-1.6x the density of water and have about 1/3 the specific heat capacity (~0.4x the specific volumetric heat capacity of water). You also have to either use hardline or neoprene tubing - Novec and it's more annoying relative, fluorinert, apparently have a nasty tendency of leaching plasticizer from normal tubing.
It's not entirely unheard of either: a few people have done it with both Novec and Fluorinert and didn't report a pressing need to go back to water.
It is however sad that Intel basically forces you to replace their factory thermal grease because they use the shittiest stuff they can get their hands on, thus limiting the CPU (probably in the hope to sell you a 10% faster CPU in about a year - that will suffer from the same high temperatures).
Apparently Intel had issues with repeated thermal shocks cracking the small desktop dies and solder with their solder-based attachment when they hit 22nm (I later did some digging and found the papers they published - the issue definitely seems real enough). As a result, they replaced it with TIM for the desktop lineup. The big, bad HEDT and server chips keep their solder-based attach for efficiency, because the die is quite literally a lot bigger.
In the case of the Intel TIM chips, from what I've been told by other delidders and various forum posts, the issue isn t actually the TIM, but rather the thickness of the TIM applied due to how thick the heatspreader glue is. Delidding gets rid of said glue and brings the whole thing so much closer makes it run so much cooler.